Methods of using fluoroepoxy compounds as adhesives for fluoroplastic adherends and products made therefrom
AssigneeThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration
InventorSheng Y. Lee
Life of this patent
Estimating the term…
Abstract
Fluoroepoxy compounds are made by reacting a fluoroepoxy resin with an effective curing agent, such as an adduct amine, and, while the compound is sufficiently liquid to wet a fluoroplastic surface, it may be applied to a fluoroplastic adherend, such as a Teflon, to be employed as an adhesive, to form various fluoroplastic products, without requiring any surface treatment of the adherend. The compounds are intentionally formulated with high fluorine contents, normally above 46% by weight, preferably for bonding fluoroplastics with a high F-content, above 55% by weight.
Claims13
A method of preparing a fluoroplastic adherend for adhesion to another body, including:
- reacting a fluorodiepoxide resin with an effective curing agent for said resin in approximately stoichiometric amounts to form a fluorodiepoxide adhesive compound, said compound having a fluorine content of at least 41% by weight;
- applying said compound, while it is sufficiently liquid to wet a fluoroplastic surface, to said fluoroplastic adherend so that said adhesive compound may be allowed to cure after contacting the coated surface of said fluoroplastic adherend with said another body.
A product including:
- a fluoroplastic body and a cured fluorodiepoxide adhesive compound in immediate contact and forming a bondline with a surface portion of said fluoroplastic body, said compound having a fluorine content of at least 41% by weight.
Dependencies are inferred from the claim text.