Multi-layer polynorbornene and epoxy laminates and process for making the same
AssigneeThe B. F. Goodrich Company
InventorsGeorge M. Benedikt, David M. Aleksa
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Abstract
Multi-layer laminates are provided of alternating or non alternating layers of reinforced epoxy and reinforced polynorbornene. The laminates are made by a process which includes an adhesion promotion step wherein at least one of the layers, prior to lamination, is pretreated with an adhesion promotion agent. Preferred adhesion promotion agents include silanes. One or more layers of copper foil can also be employed between exterior surfaces of the layers at the interface between the layers, as well as on the exterior of the laminates. The copper films can be etched to form patterns such as those suitable for printed circuit wiring boards.
Claims43
A process of producing a laminate comprising the steps of:
- (a) providing a substrate layer comprising at least one polynorbornene prepreg;
- (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate;
- (c) photo-resist imaging and etching at least a portion of the conductive film;
- and
- (d) sandwiching and laminating an additional layer, formed of at least one epoxy prepreg, between the etched surface of the substrate and the surface of an additional conductive film, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.
A process of producing a laminate comprising the steps of:
- (a) providing a substrate layer comprising at least one epoxy prepreg;
- (b) laminating a conductive film to a surface of said substrate and curing said substrate;
- (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate;
- (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer;
- (e) pretreating the surface of an additional conductive film with a silane solution effective to increase the bond strength between the conductive film and the polynorbornene layer;
- and
- (f) sandwiching, laminating and curing the polynorbornene layer between the copper-patterned surface of the substrate and the silane-treated surface of the conductive film.
A process of producing a laminate, comprising the steps of:
- (a) providing a polynorbornene solution comprising polynorbornene polymers dissolved within a solvent;
- (b) impregnating a non-cellulosic cloth with the solution and drying the impregnated cloth to remove a substantial portion of solvent to form a substrate layer;
- (c) pretreating a surface of a sheet comprising at least partially-cured epoxy resin with a solution of a silane compound effective to increase the bond strength between the substrate layer and epoxy layer;
- and
- (d) laminating the epoxy layer to the substrate layer.
A laminate comprising at least one layer comprising at least one epoxy prepreg layer laminated to at least one polynorbornene prepreg layer comprising at least one polynorbornene prepreg.
A multi-layer printed circuit wiring board comprising at least one epoxy layer laminated to at least one polynorbornene layer, an etched conductive metal pattern between the epoxy layer and the polynorbornene layer and a conductive metal film on at least one major surface of the laminate;
- said epoxy layer comprising at least one epoxy prepreg and said polynorbornene layer comprising at least one polynorbornene prepreg.
A process of producing a laminate comprising the steps of:
- (a) providing a substrate layer comprising at least one polynorbornene prepreg;
- (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate;
- (c) photo-resist imaging and etching at least a portion of the conductive film;
- and
- (d) laminating an additional layer, formed of at least one epoxy prepreg, to the etched surface of the substrate and curing the assembly, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.
A process of producing a laminate comprising the steps of:
- (a) providing a substrate layer comprising at least one epoxy prepreg;
- (b) laminating a conductive film to a surface of said substrate and curing said substrate;
- (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate;
- (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer;
- and
- (e) laminating and curing the polynorbornene layer to the copper-patterned surface of the substrate.
Dependencies are inferred from the claim text.