Vacuum processing method and apparatus
AssigneeNihon Shinku Gijutsu Kabushiki Kaisha
InventorsIzumi Nakayama, Akitoshi Suzuki, Hiroyuki Nawa, Motohiro Kaneko
Life of this patent
Estimating the term…
Abstract
A vacuum processing method and apparatus in which a DC bias to be produced on the surfaces of substrates which are to be processed in a vacuum chamber can be mechanically and easily controlled by adjusting the position of a susceptor in respect to an electrode body, and the susceptor and other components in the vacuum chamber can be easily cleaned while maintaining a desired evacuated condition and a desired processing performance in the vacuum chamber.
Claims6
In a vacuum processing method for a vacuum chamber comprising an electrode member which is electrically insulated from a wall of the vacuum chamber and supplied with an AC voltage for generating a plasma by a glow discharge in the vacuum chamber and a supporting member for supporting at least one substrate to be processed by said plasma, the improvement comprising controlling a DC bias to be generated on the surface of said supporting member or the surface of the substrate with respect to said AC voltage by varying the distance between the electrode member and the supporting member.
Dependencies are inferred from the claim text.