Process and apparatus for assembling two films, in particular films of a few microns thickness
AssigneeCentre National D'Etudes Spatiales (Cnes)
InventorRobert Regipa
Life of this patent
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AssigneeCentre National D'Etudes Spatiales (Cnes)
InventorRobert Regipa
Estimating the term…
The invention relates to a process for joining films by heat sealing, where these films are in rolls (9) and in particular a few microns thick. In a first stage, this process consists in spreading out a first film (1) on an assembly table (5) while hemming one of its longitudinal edges with a junction tape (3) and an positioning tape (4) sealed on that side of the junction tape (4) which is opposite the film. Once the desired film length has been reached, the film is transversely cut off and the positioning tape (4) then is used to handle this first film (1) and to assure its alignment with a segment of the film (2) packed on the roll (9). The second joining stage then consists in spreading out the film (2) on the table (5) while sealing a longitudinal edge of said film (2) to the outer side of the junction tape (3) following separation of the positioning tape (4) from this junction tape (3).
Apparatus for joining two films (1, 2) and of the type comprising an assembly table (5) to spread out the films, film-supply means (9), means (24, 25, 27) supplying reinforcing bands (3, 4) and a movable unit (6, 7) which is longitudinally displaceable above the assembly table (5) and holding on one hand positioning means (10, 11, 26, 33, 34) designed to align the edges to be joined of the films (1, 2) and the reinforcing band (3, 4) and on the other hand heatsealing means (14, 15, 16, 17) for said films and reinforcing band, said apparatus comprising:
Dependencies are inferred from the claim text.