Method of producing brazing metals
AssigneeNGK Insulators, Ltd.
InventorNobuo Tsuno
Life of this patent
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Abstract
Active brazing metals that can joint ceramic members mutually or a ceramic member and a metallic member to each other with high joint strength and improved availability can be provided in various shapes such as plate or wire, even when a metal of poor ductility is used as a raw material of the brazing metals.
Claims12
A method of producing brazing metals having a layered structure for joining ceramic members mutually or a ceramic member and a metallic member to each other comprising:
- adjusting at least one surface of a metal substrate to a surface roughness of center line average height of Ra of 0.5-2.0 microns;
- and
- applying at least one active metal layer, which has a melting point higher than that of the metal substrate, on said at least one surface of said metal substrate by a process selected from the group consisting of physical vapor deposition, chemical vapor deposition, and metal plating, to a thickness of 5.times.10.sup.-4 -0.1 mm, such that a thickness ratio or a thickness to diameter ratio of the active metal layer to the metal substrate is in a range of 1.times.10.sup.-2 -1.times.10.sup.-1 and a weight ratio of the active layer to the metal substrate is in a range of 0.7-4.4%.
A method of producing brazing metals having a layered structure for joining ceramic members mutually or a ceramic member and a metallic member to each other comprising:
- adjusting at least one surface of a metal substrate to a surface roughness of center line average height of Ra of 0.5-2.0 microns;
- and
- applying at least one active metal layer, which has a melting point higher than that of the metal substrate, on said at least one surface of said metal substrate by a process selected from the group consisting of physical vapor deposition, chemical vapor deposition, and metal plating, to a thickness of 5.times.10.sup.-4 -0.1 mm, such that a thickness ratio or a thickness to diameter ratio of the active metal layer to the metal substrate is in a range of 1.times.10.sup.-2 -1.times.10.sup.-1 and an atomic ratio of the active metal layer to the metal substrate is in a range of 1.2-5.4%.
Dependencies are inferred from the claim text.