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US 4,901,203 AGranted
Hybrid integrated circuit module assembly
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsTetsuo Kobayashi, Teruhisa Ohkawa
Life of this patent
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Abstract
A hybrid integrated circuit module asssembly includes a conductive casing having at least a pair of inner surfaces facing each other, first and second insulating substrates mounted on the inner surfaces and facing each other, and first and second circuits which may be a power amplifier circuit and a driving circuit for driving the power amplifier circuit, the first and the second circuits being formed on the facing surfaces of the first and second insulating substrates, respectively.
Claims3
A hybrid integrated circuit module assembly comprising:
- an electrically conductive plate having opposed first and second surfaces;
- an electrically conductive cap including inner and outer surfaces, an opening, and a pair of flanges extending from said cap adjacent the opening wherein said cap is mechanically and electrically joined at said flanges to said first surface of said plate;
- first and second insulating substrates disposed inside said cap on said inner surface and said first surface, respectively;
- and
- first and second circuits disposed facing each other on said first and second insulating substrates, respectively.
2 more elements
Dependencies are inferred from the claim text.