Electronic apparatus having semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsHideki Sato, Nobuyuki Mizunoya
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Abstract
Disclosed is an electronic apparatus wherein a large power consumption type semiconductor device is mounted on a ceramic substrate of sintered aluminum nitride with high thermal conductivity for improving a heat dissipation effect. The electronic apparatus is, for example, an ignitor. The aluminum nitride-made ceramic substrate having the semiconductor device is provided in a metallic vessel made of aluminum or the like. Employed is a thermal stress strain-resistant adhesive agent with high thermal conductivity such as a silicone type adhesive agent for bonding. The thermal stress strain-resistant adhesive agent layer serves as a cushioning layer for a heating and cooling cycle and therefore improves a heat cycle resistance.
Claims7
An electronic apparatus, comprising
- a ceramic substrate of sintered aluminum nitride;
- a metallized layer formed on a first surface of said ceramic substrate;
- a semiconductor device mounted on said metallized layer;
- a metallic vessel for holding said ceramic substrate with said semiconductor device, bonded on an opposite surface of the first surface of said ceramic substrate by means of a thermal stress and strain-resistant adhesive agent;
- and
- wherein an internal portion of said metallic vessel is resin-sealed.
Dependencies are inferred from the claim text.