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US 4,901,041 AGranted
High-performance package for monolithic microwave integrated circuits
AssigneeGrumman Corporation
InventorRaymond S. Pengelly
Life of this patent
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AssigneeGrumman Corporation
InventorRaymond S. Pengelly
Estimating the term…
The present invention incorporates a specially-designed low-pass filter into the feedthrough of a monolithic microwave integrated circuit (MMIC) to provide compensation for discrepancies from the impedance required for an MMIC package to be matched to a transmission line. The compensation allows all parameters to be adjusted and the complete filter to be printed. The main features of the invention include minimum width for the under-wall conductor and brazing metallization, two open-circuited stubs at the package-die interface for wire bonding ease, and metal-filled vias connecting the ground plane base and the lid sealing ring to bring the lid sealing ring to RF ground. The present ivention also includes a method for designing the desired feedthrough that obviates the need for scale-model feedthrough design before printing, a prior art method that requires precision in the scale model. An electrical model of a feedthrough is first derived. The electrical model is then adjsuted according to the parameters desired for a new, compensated feedthrough using any known method, including software such as Touchstone. Finally, the new feedthrough is fabricated based upon the adjusted electrical model.
A compensated feedthrough for a monolithic microwave integrated circuit package, comprising:
A monolithic microwave integrated circuit package, comprising:
A monolithic microwave integrated circuit package, comprising:
A method for designing a compensated feedthrough for an integrated circuit package, comprising the steps of:
Dependencies are inferred from the claim text.