Apparatus having a buckling beam probe assembly
AssigneeAmerican Telephone and Telegraph Company, AT&T Bell Laboratories
InventorsWilliam E. Benedetto, Joseph M. Moran
Life of this patent
Estimating the term…
Abstract
An apparatus for testing of electrical circuits has a buckling beam probe assembly having advantageous features that make it useful for contacting area arrays of test points, and for reliably establishing contact therewith. The probe elements remain essentially parallel even in the buckled state, and the probe tips execute a small "wiping" movement on the contact point. In some preferred embodiments the probe tips are shaped to result in reduced contact area.
Claims6
Apparatus for electrically testing an electrical circuit comprising an array of test points on an essentially planar substrate, the apparatus comprising a buckling beam probe assembly comprising
- (a) a first guide element comprising a central portion that contains a multiplicity of through-holes forming an array that corresponds to the array of test points;
- (b) a second guide element;
- (c) spacer means that serve to maintain the second guide element spaced apart from, and in fixed relationship with, the first guide element, the spacer elements being arranged such that the central portion of the first and of the second guide element is unobstructed by the spacer means;
- (d) a multiplicity of buckling beam probe elements, any given probe element attached to the second guide element, extending through one of the holes in the first guide element and a small distance beyond, and being essentially parallel with the other probe elements;
- and
- (e) conductor means making electrical contact with at least one of the probe elements;
- wherein
- (f) the second guide element comprises a body having a first surface and a second surface substantially parallel to the first surface, the body comprising an array of through-holes that corresponds to the array in the first guide element, the through-holes extending between the first and second surfaces, the probe elements secured to the respective holes in the body, the array of holes in the first guide element being laterally offset with respect to the array in the body, whereby a predetermined buckling direction is imposed on the probe elements;
- and wherein the means of
- (e) comprise a multiplicity of conductor lines disposed on the first surface of the body, a given conductor line serving to electrically connect a probe element with a corresponding contact means disposed on the first surface;
- and wherein
- (g) the body is a Si body, the Si body is secured to a circuit board comprising conductive features, and a given contact means on the major surface of the Si body is electrically connected to a conductive feature on the circuit board.
Dependencies are inferred from the claim text.