Back to results
US 4,900,602 AGranted
Printed wiring board
AssigneeNippon CMK Corp.
InventorsShin Kawakami, Satoshi Haruyama, Hirotaka Okonogi, Katsutomo Nikaido, Junichi Ichikawa
Life of this patent
Estimating the term…
Abstract
The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.
Claims8
A printed wiring board comprising:
- a substrate composed of electrically insulative material and having a pair of opposed major surfaces;
- a printed wiring circuit printed on one major surface of the substrate and having two spaced-apart wiring terminals;
- a carbon-containing resistor formed on the one major surface of the substrate in the region between the two spaced-apart wiring terminals, the resistor being in electrical contact with the two wiring terminals;
- an electrically insulative film layer disposed on and completely covering the two wiring terminals and the resistor;
- and a heat-dissipating film layer disposed on and completely covering the electrically insulative film layer at least in the region where the electrically insulative film layer covers the two wiring terminals and the resistor to effectively dissipate heat energy produced in the resistor during use of the printed wiring board.
2 more elements
Dependencies are inferred from the claim text.