Process for the electrostatic lacquering of printed circuit boards
OwnerKlaus Grah, Gunter Korsten +1inventors
InventorsKlaus Grah, Gunter Korsten, Werner Schauf
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Abstract
A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the process is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. An apparatus for the electrostatic lacquering of printed circuit boards is also disclosed.
Claims3
A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires, comprising continuously conveying the printed circuit boards in a suspended position to a first lacquering station, a turning station, a second lacquering station and a drying station, lacquering the printed circuit boards in the first lacquering station on one side thereof, turning the printed circuit boards over in the turning station, lacquering the printed circuit boards in the second lacquering station on the other side thereof, and simultaneously drying the two lacquered sides in the drying station.
Dependencies are inferred from the claim text.