Low cure cathodic electrodeposition coatings
AssigneeE. I. Du Pont de Nemours and Company
InventorsDing Yu Chung, Tapan K. DebRoy
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Abstract
A low temperature cure electrodepositable cathodic resin is disclosed. The resin is the reaction product of a polyepoxide amine adduct and a novel blocked crosslinking agent. The crosslinking agent of our invention is tetramethylxylene diisocyanate blocked with any suitable blocking agent. The resulting resin can be cured at relatively low temperatures (250.degree.-275.degree. F.), which potentially allows the use of the resin with articles containing plastics.
Claims7
A resin composition for use as the film forming component in a cathodic electro-deposition process, comprising the reaction product of (A) a polyepoxide amine adduct and (B) a trimerized cross-linking agent, said crosslinking agent being formed by bringing into contact about three moles of tetramethyl xylene diisocyanate and about one mole of trimethylolpropane under conditions that will cause a reaction and then blocking the reaction product with about three moles of an oxime, wherein the resin composition can be cured at temperatures below 275.degree. C.
Dependencies are inferred from the claim text.