Method of bonding via electrorheological adhesives
AssigneeThe Boeing Company
InventorJoseph C. Johnson
Life of this patent
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Abstract
Adhesives and coating are formulated with electrorheological materials to thicken when subjected to an electric field. The adhesives are thin and easy to apply, but thicken to prevent running while the adhesive cures or sets. A uniform bond along the joint is formed, thereby eliminating the uneven or discontinuous adhesive bonds made with conventional adhesives that reduce the strength and integrity of the joint.
Claims23
A method for bonding a first surface to a second surface by applying a curable adhesive composition containing a fluid adhesive component to at least one surface wherein the improvement comprises:
- (a) using an adhesive composition containing an electrorheological material, said electroheological material present in an amount serving to increase the viscosity of the adhesive composition to a gel state when an electric field is applied to the adhesive composition;
- (b) applying the adhesive composition to at least one surface;
- (c) positioning the first surface immediately adjacent to the second surface such that said adhesive composition contacts both surfaces;
- (d) applying the electric field to the adhesive composition, said electric field cooperating with the electrorheological material to increase the viscosity of the adhesive composition to a gel state;
- and
- (e) curing the fluid adhesive component.
A method for bonding two surfaces together comprising the steps of:
- (a) applying a fluid adhesive in a bondline between the two surfaces to be bonded, the adhesive including an effective amount of an electrorheological fluid sufficient for gelling the adhesive when an electric field is applied to the adhesive;
- (b) applying the electric field to the adhesive to gel the adhesive;
- and,
- (c) curing the adhesive while continuing to apply the electric field.
Dependencies are inferred from the claim text.