Method and liquid preparation for removing residues of auxiliary sawing materials from wafers
AssigneeWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
InventorsGerhard Brehm, Manuela Knipf, Rudolf Mayrhuber, Jurgen Schuhmacher, Max Stadler
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Abstract
A process and liquid preparation is disclosed for removing residues from ers sawn from crystalline rods. In sawing rod-shaped workpieces such as semiconductor rods, for example, into wafers, by means of an internal-hole saw, auxiliary sawing materials such as for example cutting strips are often attached to the rods. According to the present invention, the residues of such auxiliary sawing materials remaining on the wafers obtained after the sawing operation can be removed particularly easily by means of immersion in baths of aqueous carboxylic solutions and, in particular, aqueous formic acid.
Claims16
A process for removing a residue of auxiliary sawing materials from wafers which are obtained by sawing rod-shaped workpieces, in particular, crystalline rods, comprising the step of:
- bringing the wafers having the residue of the auxiliary sawing material adhesively bonded to the wafer edge into contact with an aqueous solution of one or more carboxylic acids containing two to six carbon atoms, wherein formic acid is included as one of said carboxylic acids, and keeping the wafers in contact with said aqueous solution of one or more carboxylic acids until the bond between the wafers and the residue of the auxiliary sawing material is separated.
A process for removing a residue of auxiliary sawing materials from wafers which are obtained by sawing rod-shaped workpieces, in particular, crystalline rods, comprising the step of:
- bringing the wafers having the residue of the auxiliary sawing material adhesively bonded to the wafer edge into contact with an aqueous solution of formic acid and keeping the wafers in contact with the aqueous solution of formic acid until the bond between the wafers and the residue of the auxiliary sawing material is separated.
Dependencies are inferred from the claim text.