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US 4,900,283 AGranted
Method for arranging chips each having an array of semiconductor light emitting elements
AssigneeKentek Information Systems, Inc.
InventorKensuke Fukae
Life of this patent
Estimating the term…
Abstract
A multiple chip LED linear array including 2048 elements is achieved by a unique wafer dicing technique which allows LEDs in abutting chips to be separated by the same distance as adjacent elements on a single chip. The linear array is employed in photocopy apparatus to discharge a linear segment of a photosensitive drum.
Claims7
A method of forming a linear array of semiconductor chips having semiconductor light emitting elements disposed thereon for use in connection with a photosensitive element for the formation of images, comprising the steps of:
- placing first and second cutting wheels in juxtaposition against first and second surfaces on opposite sides of a semiconductor wafer, said first and second cutting wheels each having a two-sided bevel cutting edges,
- bringing said first and second cutting wheels into contact with said first and second surfaces thereby cutting said semiconductor wafer into chips with a two-sided bevel at at least one end, each of said chips having a linear array of semiconductor light emitting elements disposed thereon, each of said semiconductor light emitting elements being characterized by a dimension X and being separated from each other by a separation distance S along said linear array, and
- positioning said cut chips along a common axis with their two-sided bevels abutting each other so that a semiconductor light emitting element at an end of one chip is separated by said separation distance S from a semiconductor light emitting element at an adjoining end of an adjoining chip.
Dependencies are inferred from the claim text.