Automatic soldering method and device
AssigneeApollo Seiko Ltd.
InventorSeiji Kawaguchi
Life of this patent
Estimating the term…
Abstract
The automatic soldering method and related device of this invention can perform both spot soldering and continuous soldering at any soldering position through the application of heat to both the soldering spot and the string solder, using as a heating means, a light beam such as a laser beam. This thus avoids the use of a soldering iron as a heating means and further, the soldering spot is not damaged since heat can be applied to the spot and string solder by a "non-contact" means.
Claims11
A method of automatic soldering of a first component to a second component in an area, comprising the steps of:
- heating the area directly by irradiation of said area with a light beam;
- activating flux on said area by direct irradiation of said flux with said light beam;
- directly melting a tip of string solder with said light beam by placing the tip of said string solder in the path of radiation from said light beam;
- and
- applying said melted string solder to said area so as to solder said area with said melted string solder.
An automatic soldering device for soldering a first component to a second component in an area, said device comprising:
- (a) light beam irradiation means for:
- (i) heating the area directly by irradiation of said area with a light beam,
- (ii) activating flux on said area by direct irradiation of said flux with said light beam, and
- (iii) directly melting a tip of string solder with said light beam by placing said tip in the path of radiation from said light beam;
- and
- (b) string solder supplying means for freely supplying string solder to said path of radiation from said light beam so that said string solder is melted by said light beam and deposited on said area.
Dependencies are inferred from the claim text.