Method of fabricating a high density electrical interconnect
AssigneeMicroelectronics and Computer Technology Corporation
InventorsCurtis N. Potter, Lawrence N. Smith, Harry Kroger
Life of this patent
Estimating the term…
Abstract
A high density electrical interconnect having a plurality of metallic conductors supported from metallic pillars which are electrically isolated from the ground plane by openings. The interconnect can be fabricated using a temporary support dielectric, which may be removed after completion to provide an air dielectric or be replaced with a more suitable permanent dielectric. The removal of the temporary support allows the conductors to be coated with protective layers or with a layer of a higher conductivity.
Claims5
A method of fabricating a high density electrical interconnect system comprising,
- covering a substrate with a layer of an insulating material,
- applying an adhesion layer to the insulating material,
- applying a conductive ground plane and a plurality of first layers of support pillars over the adhesion layer leaving openings in the ground plane around the first layers for isolating the support pillars from the ground plane,
- applying a second adhesion layer to the first layers and the ground plane,
- applying a second layer of insulating material over the second adhesion layer,
- etching holes in the second layer of insulating material over the first layers of the support pillars,
- plating a second layer onto each of the first layers of the support pillars,
- applying a third adhesion layer over the second layer of the support pillars,
- applying a third layer of insulating material over the third adhesion layer,
- etching the third layer of insulating material to form openings for a third layer of support pillars and at least one metallic conductor,
- plating into the openings in the third layer of insulating material a third layer of support layers onto some of the second layers of support layers,
- forming additional layers of support pillars and metallic conductors above the third layer of support layers and said metallic conductor, and
- removing the layers of insulating material.
Dependencies are inferred from the claim text.