Copper-exuding boroaluminosilicate glasses
AssigneeCorning Incorporated
InventorsGerald D. Fong, Sheryl L. Hultman
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Abstract
There is disclosed a family of low dielectric, copper-exuding, boroaluminosilicate glasses particularly adapted to use in forming substrates for electronic devices such as integrated circuits. The glasses are capable of exuding copper oxide, have a coefficient of thermal expansion of 30-35.times.10.sup.-7 at 300.degree. C., a dielectric constant not over 5.0 at 100 KHz, a loss tangent not over 0.003 at 100 KHz and consist essentially, in percent by weight, of 56-64% SiO.sub.2 18-25% B.sub.2 O.sub.3, 3-11% Al.sub.2 O.sub.3, 0-2% CaO, 0-2% Li.sub.2 O, 0-1% K.sub.2 O, the Li.sub.2 O+K.sub.2 O+CaO being 1.5-3% and 1-20% CuO.
Claims4
An electronic device comprising a silicon element and a substrate for the element formed from a low dielectric, copper-exuding, boroaluminosilicate glass consisting essentially of, in percent by weight on the oxide basis, 56-64% SiO.sub.2, 18-25% B.sub.2 O.sub.3, 3-11% Al.sub.2 O.sub.3, 0-2% CaO, 0-2% Li.sub.2 O, 0-1% K.sub.2 O, the total Li.sub.2 O+K.sub.2 O+CaO being 1.5-3%, and 1-20% CuO, and having a coefficient of thermal expansion of 30-35.times.10.sup.-7 at 300.degree. C., a dielectric constant not over 5.0 at 100 KHz, and a loss tangent not over 0.003 at 100 KHz.
Dependencies are inferred from the claim text.