Self-developing radiation sensitive resist with amorphous polymer having haloalkyl substitution derived from cycic ether
OwnerJames C. W. Chieninventor
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OwnerJames C. W. Chieninventor
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A self-developing radiation resist having extremely high sensitivity to energetic radiation, which resist is resistant to dry etching. The energetic radiation includes electron beam radiation, ion beam radiation, x-ray radiation, and gamma ray radiation. The resist is substantially amorphous; it has extremely high values of G.sub.s and G.sub.m, where G.sub.s =number of main chain scission/100 electron volts absorbed and G.sub.m =number of monomers liberated/100 electron volts absorbed. The resist is end-capped to render it thermally stable and typically is cross-linked to reduce dry etching. The polymer that forms the resist includes an oxygen heteroatom linear chain organic polymer having haloalkyl substituents and is adapted to depolymerize in the absence of photoinitiators.
A radiation resist having extremely high sensitivity to energetic radiation, which resist is self-developing and is resistant to dry etching, said energetic radiation including electron beam radiation, ion beam radiation, x-ray radiation, and gamma ray radiation, said resist being in the form of a substantially amorphous oxygen heteroatom linear chain polymer with haloalkyl substituents, said polymer being derived from (a) a cyclic ether, (b) a haloalkyl substituted cyclic ether, or (c) a cyclic ether with an aliphatic aldehyde, at least one of which includes a haloalkyl substituent, which polymer is adapted to depolymerize in the absence or presence of photo initiators, said polymer being of the formula ##STR5## wherein R.sub.1 is a haloalkyl substituent of the formula --CH.sub.2-a X.sub.a R', R' is X or an alkyl, haloalkyl, aryl or silyl substituent having 1 to 6 carbon atoms, X is chlorine or fluorine, a is 1 or 2, excluding F.sub.2 CH-- and FCH.sub.2 --;
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