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US 4,891,330 AGranted
Method of fabricating n-type and p-type microcrystalline semiconductor alloy material including band gap widening elements
AssigneeEnergy Conversion Devices, Inc.
InventorsSubhendu Guha, Stanford R. Ovshinsky
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Abstract
A method of fabricating doped microcrystalline semiconductor alloy material which includes a band gap widening element through a glow discharge deposition process by subjecting a precursor mixture which includes a diluent gas to an a.c. glow discharge in the absence of a magnetic field of sufficient strength to induce electron cyclotron resonance.
Claims11
A method of fabricating doped microcrystalline semiconductor alloy material which includes a band gap widening element, said method including the steps of:
- providing a deposition chamber;
- providing a substrate in said deposition chamber;
- vacuumizing said deposition chamber;
- providing a precursor mixture including a semiconductor-containing gas, a dopant-containing gas and a band gap widening element-containing gas;
- said mixture further including a diluent gas;
- coupling a source of a.c. energy into the interior of the deposition chamber;
- subjecting said precursor mixture to an a.c. glow discharge in the absence of a magnetic field of sufficient strength to induce electron cyclotron resonance, said magnetic field not caused solely by said a.c. initiated glow discharge;
- and
- depositing doped microcrystalline semiconductor alloy material, said material formed by a random network of relatively low conductvity, disordered regions surrounding highly ordered crystalline inclusions, said volume fraction of crystalline inclusions being sufficient to provide a relatively low resistance current path through the random network, whereby the material exhibits dark electrical conductivity of at least 0.5 ohm.sup.-1 cm.sup.-1 and a band gap of at least 1.9 eV.
6 more elements
Dependencies are inferred from the claim text.