Dynamic force measurement system

A dynamic bond force measurement system for taking a series of force measurements of force applied by a wire bonding tool, the system comprising:

• a sensor device for positioning beneath a wire bonding tool, comprising a substrate platform, a transducer element mounted on said platform, and a pressure pedestal mounted on said transducer element for receiving the force applied by a wire bonding tool;
• the transducer element comprising means for detecting forces between the pedestal and the substrate platform in the range form 0.00 to 2.00 lbs. and for producing a continuous analog output signal in the range form 0.00 to 100.00 millivolts in relation to said force;
• a sensor interface device for receiving said analog output signal, the interface device comprising analog to digital converter means for converting said analog output signal, data storage means for storing discrete values of said digital output signal at a preselected sample rate, triggering means for initiating said data storage, and output means for transmitting said stored digital output signals;
• and
• data processing means for receiving said digital output signals from said interface device, means for storing said received signals, and means for generating from said signals a graphical representation of the applied force relative to time.