Electronic packaging of components incorporating a ceramic-glass-metal composite

A semicondutor casing adapted to receive a semiconductor device, comprising:

• a body component having a cavity, said body component being formed of a ceramic-glass-metal composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of;
• up to about 25 volume % ductile metallic particles for enhancing the flow characteristics of said composite;
• 15 volume % to about 50 volume % glass for adhering said composite together;
• the balance ceramic particles having a particle diameter greater than about 1 micron;
• and
• said metal and ceramic particles selected so that each has a melting temperature greater than the melting temperature of said glass particles;
• a metallic leadframe, said leadframe being embedded into said body component, said leadframe having lead ends extending into said cavity and adapted to be connected to a semiconductor device;
• and
• lid means adapted for sealing said cavity.

A semiconductor casing, comprising:

• a body component having a cavity, said body component being formed of ceramic-glass-metal composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of:
• up to about 25 volume % deductile metallic particles for enhancing the flow characteristics of said composite;
• 15 volume % to about 50 volume % glass for adhering said composite together;
• and
• the balance ceramic particles having a particle diameter greater than about 1 micron;
• and
• said metal and ceramic particles selected so that each has a melting temperature greater than the melting temperature of said glass particles;
• a metallic cup embedded into said body component, said metallic cup having a surface within said cavity, said surface being adapted to have a semiconductor device bonded thereto, said cup further having sidewalls extending to said surfaces of the casing, the cup further having sidewalls extending to said surface of the casing, the cup further including a flange extending from the sidewalls to form a first portion of an outer surface of the casing and to provide a heat sink for the casing;
• a leadframe embedded in said body component and having leads ends extending into said cavity and adapted to be connected to a semiconductor device;
• and
• lid means disposed against said body component for sealing said cavity.

A multilayer circuit device, comprising:

• a plurality of ceramic-glass-metal substrates, each such substrate having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of:
• an effective amount comprising up to about 25 volume % metallic particles for enhancing the flow characteristics of said composite, said metallic particles selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof;
• 15 volume % to about 50 volume % glass for adhering said composite together, said glass being either vitreous or devitrified and selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses;
• and
• the balance ceramic particles having a particle diameter greater than about 1 micron selected from the group consisting of Al.sub.2 O.sub.3, SiC, BeO, TiO.sub.2, ZrO.sub.2, MgO, AlN, Si.sub.3 N.sub.4, BN and mixtures thereof;
• a layer of an electrically conductive circuit pattern bonded between adjacent ceramic-glass-metal substrates;
• and
• conductive means extending through each of said plurality of ceramic-glass-metal substrates to contact said electrically conductive circuit pattern.

A hybrid circuit device, comprising:

• a ceramic-glass-metal substrate having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of;
• an effective amount comprising up to about 25 volume % metallic particles for enhancing the flow characteristics of said composite, said metallic particles selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof;
• 15 volume % to about 50 volume % glass for adhering said composite together, said glass being either vitreous or devitrified and selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses;
• and
• the balance ceramic particles having a particle diameter greater than about I micron selected from the group consisting of Al.sub.2 O.sub.3, SiC, BeO, TiO.sub.2, ZrO.sub.2, MgO, AlN, Si.sub.3 N.sub.4, BN and mixtures thereof;
• a layer of an electrically conductive circuit pattern bonded to at least one surface of said substrate;
• and
• conductive means extending through said substrate to contact said electrically conductive circuit pattern.

A semiconductor casing, comprising:

• first and second components formed from a ceramic-glass-metal composite material, said composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, said composite material further having a composition of;
• up to about 25 volume % metallic particles for enhancing the flow characteristics of said composite, said metallic particles selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof;
• 15 volume % to about 50 volume % glass for adhering said composite together, said glass being either vitreous or devitrified and selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses;
• and
• the balance ceramic particles having a particle diameter greater than about 1 micron selected from the group consisting of Al.sub.2 O.sub.3, SiC, BeO, TiO.sub.2, ZrO.sub.2, MgO, AlN, Si.sub.3 N.sub.4, BN and mixtures thereof;
• a metallic leadframe, said leadframe being embedded into said first component;
• and
• a sealing glass bonding said second component to said lid component.

A semiconductor casing, comprising:

• a body component having a cavity adapted to receive a semiconductor device, said body component being formed of a ceramic-glass-metal composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of;
• up to about 25 volume % metallic particles for enhancing the flow characteristics of said composite, said metallic particles selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and alloys thereof;
• 15 volume % to about 50 volume % glass for adhering said composite together, said glass being either vitreous or devitrified and selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses;
• and
• the balance ceramic particles having a particle diameter greater than about 1 micron selected from the group consisting of Al.sub.2 O.sub.3, SiC, BeO, TiO.sub.2, ZrO.sub.2, MgO, AlN, Si.sub.3 N.sub.4, BN and mixtures thereof;
• a metallic leadframe, said leadframe being embedded into said body component, said leadframe having lead ends extending into said cavity and adapted to be connected to a semiconductor device;
• and
• lid means adapted for sealing said cavity.

A semiconductor casing, comprising:

• a body component having a cavity adapted to receive a semiconductor device, said body component being formed of a ceramic-glass-metal composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, and further having a composition of;
• up to about 25 volume % metallic particles for enhancing the flow characteristics of said composite, said metallic particles selected from the group consisting of aluminum, copper, iron, silver, gold, stainless steel and aloys thereof;
• 15 volume % to about 50 volume % glass for adhering said composite together, said glass being either vitreous or devitrified and selected from the group consisting of silicate, borosilicate, phosphate, zinc-borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate glasses;
• and
• the balance ceramic particles having a particle diameter greater than about 1 micron selected from the group consisting of Al.sub.2 O.sub.3, SiC, BeO, TiO.sub.2, ZrO.sub.2, MgO, AlN, Si.sub.3 N.sub.4, BN and mixtures thereof;
• a metallic cup embedded into said body component, said metallic cup having a surface within said cavity, said surface being adapted to have a semiconductor device bonded thereto, said cup further having sidewalls, extending to said surface of the casing, the cup further including a flange extending from the sidewalls to form a first portion of an outer surface of the casing and to provide a heat sink for the casing;
• a leadframe embedded in said body component and having lead ends extending into said cavity and adapted to be connected to a semiconductor device;
• and
• lid means disposed against said body component for sealing said cavity.