Cooling system for an electronic circuit device
AssigneeFujitsu Limited
InventorsHaruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama, Izumi Ono, Shunichi Kikuchi
Life of this patent
Estimating the term…
Abstract
A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
Claims36
In an electronic circuit device comprising a printed circuit board supporting thereon at least one electronic circuit component connected thereto by first solder means, a cooling system for the component including a cooling module which comprises a conduit for coolant flow, a first heat transfer plate directly exposed to the flow of the coolant for transferring the heat dissipated from the circuit component to the coolant, second solder means between the heat transfer plate and the circuit component for establishing a compliant contact between the first heat transfer plate and the circuit component through the second solder means, and elastic means connected to the first heat transfer plate for resiliently biasing the first heat transfer plate toward the circuit component, said second solder means having a melting point which is lower than that of the first solder means so as to ensure that the second solder means melts at a temperature where the first solder means remains solid.
Dependencies are inferred from the claim text.