Lead-free frit
AssigneeChi-Vit Corporation
InventorsPaul R. Lee, Joseph P. Hingsbergen
Life of this patent
Estimating the term…
Abstract
A lead-free frit suitable for use on aluminum, consisting essentially of: ______________________________________ 33-42 wt. % SiO.sub.2 8-13 TiO.sub.2 0.5-2.5 SnO.sub.2 0.5-2.5 BaO 2.5-5.0 in the absence of Ce.sub.2 O.sub.3 ; 0-4.5 if Ce.sub.2 O.sub.3 is present. SrO 2.2-4.3 ZnO 13-26 Na.sub.2 O 4-9 K.sub.2 O 0.7-6.0 Li.sub.2 O 0.5-4.5 B.sub.2 O.sub.3 1.0-3.5 Sb.sub.2 O.sub.3 0-0.8 Ce.sub.2 O.sub.3 0.5-5.0 P.sub.2 O.sub.5 0.2-1.3 MoO.sub.3 ______________________________________ The frit has a fusion temperature below about 1050.degree. F. and displays good qualities of gloss, acid resistance, and adhesion.
Claims5
A lead-free frit suitable for use on aluminum and its alloys, said frit consisting essentially of about:
- ______________________________________ 33-42 wt. % SiO.sub.2 8-13 TiO.sub.2 0.5-2.5 SnO.sub.2 0.5-2.5 BaO 2.5-5.0 in the absence of Ce.sub.2 O.sub.3 ;
- 0-4.5% if Ce.sub.2 O.sub.3 is present. SrO 2.2-4.3 ZnO 13-26 Na.sub.2 O 4-9 K.sub.2 O 0.7-6.0 Li.sub.2 O 0.5-4.5 B.sub.2 O.sub.3 1.0-3.5 Sb.sub.2 O.sub.3 0-0.8 Ce.sub.2 O.sub.3 0.5-5.0 P.sub.2 O.sub.5 0.2-1.0 MoO.sub.3 ______________________________________
- said frit having a fusion temperature below about 1050.degree. F.
Dependencies are inferred from the claim text.