Apparatus for the metal working of components
AssigneeAATEC Assembling Automations Technik GmbH
InventorGerhard Hinterlechner
Life of this patent
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Abstract
An apparatus for removing tie bars from between the leads of a semiconductor device during the manufacture of said device comprises a punch guide having a plurality of guide slots and a die block aligned with and spaced from the punch guide so as to provide a space therebetween. The die block is provided with a plurality of die slots which are in axial alignment with the plurality of guide slots in the punch guide. A plurality of punches are axially aligned with the guide slots and the die slots. A transmission mechanism is provided for selectively moving the die block toward the punch guide and the plurality of punches toward the die block such that the punches pierce the space between the die block and punch guide for removing the tie bars from between the leads.
Claims13
An apparatus for use in a stamping operation comprising a reference block having a surface defining a reference plane;
- a die block movably mounted on said reference block for movement along said surface defining said reference plane, said die block having at least one die slot;
- at least one punch movably mounted on said reference block for movement along said surface defining said reference plane such that said at least one punch is axially aligned with and spaced from said at least one die slot;
- and moving means for simultaneously moving said die block and said at least one punch along said surface defining said reference plane on said reference block whereby said die block moves towards said at least one punch and said at least one punch moves towards said die block during the stamping operation.
Dependencies are inferred from the claim text.