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US 4,865,686 AGranted
Laser scribing method
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorHisato Sinohara
Life of this patent
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Abstract
A laser scribing system and method is described. In the system, a film formed on a substrate is irradiated with laser beam which is focused on a limited portion of the film in order to remove the portion and produce a groove. Laser beam used for eliminating the portion of film formed on a substrate is deprived of its border portion in advance of the focusing. Sperical aberration is suppressed due to this elimination.
Claims10
A method for scribing a film formed on a substrate comprising:
- expanding a laser beam from an eximer laser;
- eliminating a border portion from the expanded laser beam;
- focusing the laser beam shaped by the elimination on said substrate and removing the irradiated portion of said film.
Dependencies are inferred from the claim text.