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US 4,863,808 AGranted
Copper-chromium-polyimide composite
AssigneeGould Inc.
InventorJerome S. Sallo
Life of this patent
Estimating the term…
Abstract
A carrier for use in flexible circuits and tape-automated-bonding includes a layer of vacuum deposited metallic chromium between the copper and polyimide. The chromium is vacuum deposited on the polyimide, affords resistance to undercutting from gold and tin plating baths, and allows conductor to be deposited on both sides of the polyimide.
Claims17
A carrier comprising:
- a layer of dimensionally stable polyimide film;
- a layer of metallic chromium vapor-deposited on said polyimide;
- a layer of copper vapor-deposited on said chromium layer;
- and
- a layer of copper electrodeposited on said vapor-deposited copper layer.
2 more elements
A carrier comprising:
- a layer of dimensionally stable polyimide film;
- a layer of metallic chromium vapor-deposited on each side of said polyimide layer;
- a layer of copper vapor-deposited on each of said chromium layers;
- and
- a layer of copper electrodeposited on each of said vapor-deposited copper layers.
2 more elements
A method of manufacturing a carrier having improved resistance to undercutting from gold or tin plating baths comprising the steps of:
- providing a dimensionally stable polyimide substrate;
- vapor depositing a layer of metallic chromium on said polyimide;
- vapor depositing a layer of copper onto said chromium layer;
- and
- electrodepositing a layer of copper on said vapor-deposited copper layer.
2 more elements
Dependencies are inferred from the claim text.