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US 4,859,806 AGranted
Discretionary interconnect
AssigneeMicroelectronics and Computer Technology Corporation
InventorRobert T. Smith
Life of this patent
Estimating the term…
Abstract
A discretionary interconnect which includes orthogonal arrays of conductors sandwiched between conductive planes and accessible through a number of selectively arranged vias for interconnection and interruption. Also disclosed is a process of personalizing an interconnect of this type by selectively connecting and disconnecting the conductors.
Claims12
A discretionary interconnect, comprising:
- a first set of essentially parallel, co-planar electrically conductive wires;
- a second set of essentially parallel, co-planar electrically conductive wires, said first set of wires being orthogonal and non-planar to said second set of wires;
- a first conductive plane positioned on the side of said first set of wires opposite said second set of wires;
- a second conductive plane positioned on the side of said second set of wires opposite said first set of wires;
- a first set of vias having diameters equal to or less than about 20 mils and extending from the top surface of the interconnect to said first set of wires;
- and
- a second set of vias having diameters equal to or less than about 20 mils and extending from the top surface of the interconnect to said second set of wires.
4 more elements
A process for customizing an interconnect, comprising the steps of:
- constructing an interconnect which includes a first conductive plane, a first set of essentially parallel, co-planar conductive wires, a second set of essentially parallel, co-planar conductive wires on the side of said first set of conductive wires opposite said first conductive plane, a second conductive plane positioned on the side of said second set of wires opposite said first set of wires, a first set of vias accessing said first set of wires, and a second set of vias accessing said second set of wires, said vias having diameters equal to or less than about 20 mils and extending from the top surface of the interconnect to said first and second sets of wires, respectively;
- selectively removing sections of said wires at said vias;
- and
- selectively interconnecting said wires at said vias.
1 more element
Dependencies are inferred from the claim text.