Metal vessel having circumferential side seam and process for production thereof
AssigneeToyo Seikan Kaisha, Ltd.
InventorsHisakazu Yasumuro, Michio Watanabe, Kazuo Taira, Tsuneo Imatani, Hideo Kurashima
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AssigneeToyo Seikan Kaisha, Ltd.
InventorsHisakazu Yasumuro, Michio Watanabe, Kazuo Taira, Tsuneo Imatani, Hideo Kurashima
Estimating the term…
Disclosed is a metal vessel comprising upper and lower members, each of which consists of a seamless molded metal cup having a protecting resin cover layer, the open end portions of the upper and lower members being lap-bonded to each other through an adhesive to form a circumferential side seam, said metal vessel being characterized in that the open end portion defining the inner side of the circumferential side seam has a layer of a thermoplastic resin adhesive tape heat-bonded along the entire circumference of said end portion while wrapping the end edge and adjoining inner and outer side faces therein, a layer located on the outer side face of the adhesive tape is extended along the lap-bonded portion, and the adhesive layer present in the lap-bonded portion satisfies the following requirement: ##EQU1## wherein S1 stands for the sectional area (mm.sup.2) of the adhesive layer present in the lap-bonded portion, lo stands for the width (mm) of the lap-bonded portion, and t.sub.o stands for the thickness (mm) of the adhesive tape present on the inner side of the inner open end portion.
In a metal vessel having upper and lower members, each of which is in the form of a seamless molded metal cup having a protective resin cover layer over each of the inner and outer facing surfaces thereof with exposed metal end edges, the upper member having a pouring mouth, the upper and lower members having straight end portions fitted in a telescopic relation, the end portions of the upper and lower members being lap-bonded to each other through a thermoplastic resin adhesive forming a circumferential side seam, including inner and outer circumferential laps, the improvement comprising:
In a process for the production of metal vessels having a circumferential side seam by lap-bonding to each other the open ends of lower and upper protective resin covered seamless molded metal cup members through an adhesive to form a circumferential side seam, the improvement comprising applying a thermoplastic resin adhesive tape to the outer side face of the open end portion of the molded cup to be located on the inner side of the resulting circumferential side seam such that a part of the adhesive tape protrudes from said open end portion, bending the protruding portion of the adhesive tape inwardly to wrap the end edge and adjoining inner face of said open end portion in the bent protruding portion of the adhesive tape, fusion-bonding the bent adhesive tape to said open end portion, telescopically fitting the other molded cup over the fusion-bonded adhesive tape-applied molded cup, thereby placing the fusion-bonded adhesive layer between the open end portions of both the molded cups under compression, and fusing the compressed adhesive layer so as to bond both the open end portions to each other and so that the difference between the outer diameter of the inner open end portion and the inner diameter of the outer open end portion is 0.1 to 1.9 times the thickness of the adhesive tape, and a portion of the adhesive resin between the open end portions forming the circumferential side seam is forced to flow out from between the open end portions to form a protruded portion of adhesive resin thereby further increasing the strength and barrier properties of the circumferential side seam.
Dependencies are inferred from the claim text.