Multiple-layer, cook-in film
AssigneeW. R. Grace & Co.-Conn.
InventorTimothy T. Oberle
Life of this patent
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Abstract
Disclosed is a multiple-layer cook-in film from which packages such as bags or casings can be made. The films have a first food contact layer that bindingly adheres during cook-in to a contained meat product. The first layer comprises a polyamide composition, which is preferably (I) a polyamide or (II) a blend of a polyamide and (i) polyethylene, or a blend of a polyamide and (ii) a copolymer of an alpha-olefin having the formula RHC.dbd.CH.sub.2 wherein R is H or C.sub.1 to C.sub.8 alkyl and an alpha,beta-ethylenically unsaturated carboxylic acid.
Claims25
A multiple-layer, cook-in film having a first food contact layer (a) having been subjected to an energetic radiation surface treatment provided by a high energy electron treatment to an extent corresponding to a dosage of up to about 12 MR, said first layer (a) functioning as an adhering layer, and wherein said first layer (a) comprises a polyamide composition.
A method for improving the heat seal strength of multiple layer, cook-in film having a first food contact layer (a) that functions as an adhering layer, said method comprising (1) providing for said first layer (a) with a polyamide composition (2) extruding said first layer into a multiple layer film, and (3) prior to or after the extruding of said first layer (a), subjecting said first layer (a) to an energetic radiation surface treatment.
Dependencies are inferred from the claim text.