Sealing structure, method of soldering and process for preparing sealing structure
AssigneeHitachi, Ltd.
InventorsAkihiko Yamamoto, Akiomi Kohno, Toshihiri Yamada, Motohiro Satou, Keiji Taguchi, Kazuaki Yokoi
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Abstract
This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointing material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method. The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
Claims31
A sealing structure comprising a first board made of a material selected from the group consisting of ceramics and metals, a second board also made of a material selected from the group consisting of ceramics and metals, and a jointing member which seals the peripheral space between said first and second boards,
- wherein said jointing member comprises a first layer selected from the group consisting of an aluminum layer and an aluminum base alloy layer, a second layer having a melting point lower than that of said first layer, and a solder layer having a melting point lower than that of said second layer.
A sealing structure comprising a first board made of a material selected from the group consisting of ceramics and metals, a second board also made of a material selected from the group consisting of ceramics and metals, a metallic frame located in the pepripheral space between said first and second boards, a first jointing member which seals a peripheral space between said frame and said first board, and a second jointing member which seals a peripheral space between said frame and said second board,
- wherein said first jointing member comprises at least a first layer selected from the group consisting of an aluminum layer and an aluminum alloy layer, a second layer having a melting point lower than that of said first layer, and a solder layer having a melting point lower than that of said second layer.
A method of soldering at least two members selected from the group consisting of ceramics and metals,
- which comprises heat jointing aluminum and/or aluminum alloy to one of said two members, heat jointing a material selected from the group consisting of zinc, zinc alloy, magnesium, and magnesium alloy to the surface of said aluminum and/or aluminum alloy, and soldering the other member thereto.
A process for preparing a sealing structure comprising two ceramic members opposed to each other and a frame which has been jointed to each of said ceramic members,
- which comprises a step of jointing one of said two ceramic members to one side of said frame with a first high-melting jointing material and jointing a second high-melting jointing material to the other side of said frame, a step of jointing a medium-melting jointing material which melts at a lower temperature than said first and second high-melting jointing materials to the surface of said second high-melting jointing material which has been jointed to the other side of said frame, and a step of jointing said medium-melting jointing material to the other ceramic member of said two ceramic members opposed to each other with a low-melting jointing material which melts at a lower temperature than said medium-melting jointing material, wherein said first and second high-melting jointing materials each comprise aluminum and/or aluminum base alloy, and wherein said medium-melting jointing material comprises a material selected from the group consisting of zinc, zinc base alloy, magnesium, and magnesium base alloy.
A process for preparing a sealing structure comprising two ceramic members opposed to each other and a frame which has been jointed to each of said ceramic members,
- which comprises a step of jointing one of said two ceramic members to one side of said frame with a first high-melting jointing material and jointing a second high-melting jointing material to the other side of said frame, a step of jointing a medium-melting jointing material which melts at a lower temperature than said first and second high-melting jointing materials to the surface of said second high-melting jointing material which has been jointed to the other side of said frame, and a step of jointing said medium-melting jointing material to the other ceramic member of said two ceramic members opposed to each other with a low-melting jointing material which melts at a lower temperature than said medium-melting jointing material, wherein said first and second high-melting jointing materials each comprise a core material comprised of aluminum or aluminum base alloy and a skin material comprised of an aluminum-silicon base alloy provided on both sides thereof.
A process for preparing a sealing structure comprising two ceramic members opposed to each other and a frame which has been jointed to each of said ceramic members,
- which comprises a step of jointing one of said two ceramic members to one side of said frame with a first high-melting jointing material and jointing a second high-melting jointing material to the other side of said frame, a step of jointing a medium-melting jointing material which melts at a lower temperature than said first and second high-melting jointing materials to the surface of said second high-melting jointing material which has been jointed to the other side of said frame, wherein said second high-melting jointing material is jointed to said medium-melting jointing material through an intermediate member comprising an iron base material, aluminum base material or copper base material, said intermediate member having a melting temperature higher than that of said high-melting jointing material, and a step of jointing said medium-melting jointing material to the other ceramic member of said two ceramic members opposed to each other with a low-melting jointing material which melts at a lower temperature than said medium-melting jointing material.
Dependencies are inferred from the claim text.