Monitoring bond parameters during the bonding process
AssigneeSiemens Aktiengesellschaft
InventorKlaus-Ulrich von Raben
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Abstract
A method of monitoring bonding parameters during a bonding process. The method is based on the object of continuous monitoring of bonding parameters in order to provide adjustment of bonding machines and thereby increase the reliability of the bonded connections. A bonding force is measured by a wire strain gauge attached to a bonding arm and an ultrasound amplitude is measured by a piezo-electric sensor secured to the bonding arm. The method can be used with all bonding machines which work with ultrasound.
Claims15
A method for continuous and simultaneous monitoring of bonding parameters of at least a bonding force and of an ultrasound amplitude during bonding processes with semi-automatic and fully automatic bonding machines, comprising the steps of:
- attaching at least two measuring devices on opposed sides of a bonding arm for acquiring a bonding force parameter, these measuring devices measuring a bending mode in the vertical direction of the bonding arm which is proportional to the bonding force;
- and providing a piezo-electric sensor for measuring ultrasound amplitude, said sensor attached to a lateral milled portion on the bonding arm and producing an ultrasound signal;
- and supplying all measured values of the bending mode in the vertical direction and ultrasound amplitude to a means for data acquisition and evaluation after amplification of the measured values;
- and combining all the measured parameters to one single value which characterizes the bonding process and enables one to control the bonding machine.
A method for continuous and simultaneous monitoring of bonding parameters during bonding processes with semi-automatic and fully automatic bonding machines, comprising the steps of:
- providing a bonding arm attached to the bonding machine;
- attaching to the bonding arm at least two means for measuring bending amplitude in the vertical direction of the bonding arm and producing a bonding force signal indicative of the bending amplitude in the vertical direction, this vertical bending being proportional to a bonding force, said two means for measuring being attached to opposing sides of said bonding arm;
- attaching to a lateral milled portion of the bonding arm means for measuring ultrasound amplitude and producing an ultrasound signal indicative of the ultrasound amplitude;
- amplifying the bonding force signal and the ultrasound signal;
- supplying the amplified bonding force signal and the amplified ultrasound signal to a means for data acquisition and evaluation.
Dependencies are inferred from the claim text.