Thermally conductive gel materials
AssigneeRaychem Corporation
InventorsCatherine A. Dittmer, Robert S. Dubrow
Life of this patent
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Abstract
This invention provides new heat transfer materials comprising gels and particulate fillers and having a composite heat transfer coefficient greater than 2 watts/m-.degree. K. and preferably greater than 15. The materials are easily conformable to irregularly shaped surfaces and have low TO-3 thermal impedance values, e.g., less than 0.5 at 300 psi mounting pressure.
Claims26
An assembly comprising:
- a first substrate and a second substrate;
- said first substrate being maintained by resistive heating at a higher temperature than said second substrate;
- said first substrate comprising an electrical component;
- and,
- placed between and in heat transferring contact with said first and second substrates an article comprising a flexible carrier supporting a thermally conductive cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material a particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition;
- whereby heat is conducted from said first substrate to said second substrate.
An article comprising a flexible matrix impregnated with a cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to about 350 (10.sup.1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material a particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and 70% by weight of the composition.
A method of aiding in heat transfer comprising:
- placing on a first substrate from which or to which heat is to be conducted an article comprising a flexible carrier supporting a thermally conductive cured composition comprising:
- (a) a silicone gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material a particulate filler having a thermal conductivity of at least about 10 watts/-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition;
- applying to the exposed surface of said article a second substrate from which or to which heat is to be transferred;
- and
- applying a desired pressure to the article between the two substrates to obtain the desired heat transfer.
A method of aiding in heat transfer comprising:
- placing on a first substrate from which or to which heat is to be conducted an article comprising a flexible matrix impregnated with a thermally conductive cured conductive composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material a particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition;
- applying to the exposed surface of said article a second substrate from which or to which heat is to be transferred;
- and
- applying a desired pressure to the composition between the two substrates to obtain the desired heat transfer.
An assembly comprising:
- a first substrate, from which heat generated by resistive heating is to be conducted, and which comprises a transistor, a resistor or a diode;
- a second substrate to which heat is to conducted;
- and
- placed between and in heat transferring contact with said first and second substrates an article comprising a flexible carrier supporting a thermally conductive cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material an electrically insulative particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition.
An assembly comprising:
- a first substrate comprising an electrical component, from which or to which heat is to be conducted and which is mounted on a circuit board;
- and,
- a second substrate to which or from which heat is to be conducted;
- and
- placed between and in heat transferring contact with said first and second substrates, an article comprising a flexible carrier supporting a thermally conductive cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material an electrically insulative particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition.
A thermally conductive cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material, an electrically insulative particulate filler having a thermal conductivity of at least about 100 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition.
An article, for transferring heat from a first substrate to a second substrate, having a first surface and a second surface, both of said surfaces being adapted to be placed in heat transferring contact with said substrates, said article comprising a flexible carrier supporting an electrically insulating thermally conductive cured composition comprising:
- (a) a gel material having a cone penetration value of about 50 to 350 (10.sup.-1 mm) and an ultimate elongation of at least about 50%;
- and
- (b) dispersed in said gel material a particulate filler having a thermal conductivity of at least about 10 watts/m-.degree.K.;
- wherein the filler is present in an amount between 5% and about 70% by weight of the composition.
Dependencies are inferred from the claim text.