Apparatus for heat-treating wafers
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsYusuke Muraoka, Atsushi Tamada, Takamasa Sakai, Hitoshi Haibara, Keiji Nakagawa
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AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsYusuke Muraoka, Atsushi Tamada, Takamasa Sakai, Hitoshi Haibara, Keiji Nakagawa
Estimating the term…
An apparatus for heat-treating wafers including: a cylindrical body having an infrared reflection film formed on an interior peripheral surface thereof; a furnace core tube disposed within the cylindrical body for accommodating therein the wafers; a heater element provided within the cylindrical body for heating the furnace core tube, the heater being positioned outwardly remotely from an exterior peripheral surface of the furnace core tube in a manner to surround the tube; and a plurality of insulating heat-resistant bar members provided within the cylindrical body and extending in a direction parallel to the central axis of the furnace core tube for supporting the heater element.
An apparatus for heat-treating wafers, comprising:
An apparatus for heat-treating wafers, comprising:
An apparatus for heat-treating wafers, comprising:
An apparatus for heat-treating wafers, comprising:
Dependencies are inferred from the claim text.