Enhanced adhesion of substrate materials using ion-beam implantation
AssigneeSundstrand Corporation
InventorsJohn F. Scanlon, William D. Sherman
Life of this patent
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Abstract
A method is provided for improving the adhesion of a substrate material which does not form stable bonds to a bondable material by applying high energy bondable ions to the surface of the substrate to create an interface alloy layer and then adhering a bondable material to the surface of the substrate material. The high energy ions used may be meal ions. Before adhering, the thickness of the interface layer may be increased to form a layer utilizing conventional processes such as flame spray, plasma spray or D-gun spray. Additionally, the method may be used to join similar or dissimilar first and second substrate materials.
Claims20
A method of improving the adhesion of a substrate material which does not form stable bonds to a bondable material, comprising the steps of:
- forming an interface layer sufficient to improve adhesion on a surface of a substrate material by the bombardment of high energy bondable ions into the surface of the substrate material;
- and
- adhering the bondable material to the interface layer formed on the surface of the substrate.
A method of improving the adhesion of a substrate material which does not form stable bonds to a bondable material, comprising the steps of:
- forming an interface layer sufficient to improve adhesion on a surface of the substrate material by the bombardment of high energy bondable ions into the surface of the substrate material;
- increasing the thickness of the interface layer formed on the substrate surface to form a bondable layer thereon;
- and
- adhering the bondable material to the interface layer formed on the surface of the substrate.
Dependencies are inferred from the claim text.