Dielectric drying process for honeycomb structures

A process for dielectric-drying a honeycomb structure comprising placing a honeycomb structure on a drying support board comprising a perforated plate, a given region of which inclusive of a portion contacting with a lower opening end face of the honeycomb structure has a conductivity higher than that of a second portion, placing an upper plate comprising a perforated plate made from at least one material selected from the group consisting of aluminum, copper, aluminum alloy, copper alloy and graphite, the upper plate having a conductivity higher than that of the honeycomb structure on an upper opening end face of the honeycomb structure, and directing an electric current between an electrode arranged above the upper opening end face of the honeycomb structure and an electrode arranged beneath the lower opening end face thereof to conduct the drying.