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AssigneesHitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
InventorsAkihiko Satou, Tadao Kusaka, Shigeo Tomiyama, Kouzi Aoki, Ichiro Gyobu, Kimio Muramatsu, Hiroaki Sakamoto, Shinjiroo Ueda, Masahiro Mase, Takashi Nagaoka
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This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.
A method of producing semiconductor devices including a step of forming a semiconductor element having a PN-junction on a semiconductor substrate and a step of forming a multi-layered wiring layer comprising an electrical wiring film for said semiconductor element and an insulating film for electrically insulating predetermined portions of said electrical wiring film, wherein the semiconductor substrate is contained in a processing chamber and a polycrystalline silicon film is formed by a CVD process where a considerable amount of hydrogen gas is produced, under a pressure-reduced state in said processing chamber, the inside of said chamber being conditioned over a range from a normal pressure state to a predetermined reduced pressure state, in which the evacuating system of said processing chamber uses a pressure-reducing processing apparatus so adapted that an evacuation pump is constituted only with oil-free vacuum pump and the suction side of said oil-free vacuum pump is connected to a supply source of a gas having molecular weight higher than that of helium (He).
A method of producing semiconductor devices including a step of forming a semiconductor element having a PN-junction on a semiconductor substrate and a step of forming a multi-layered wiring layer comprising an electrical wiring film for said semiconductor element and an insulating film for electrically insulating predetermined portions of said electrical wiring film, wherein the semiconductor substrate is contained in a processing chamber and the multi-layered wiring layer is formed to the surface of the semiconductor substrate under a reduced pressure state in said processing chamber the inside of said chamber being conditioned over a range from a normal pressure to a predetermined reduced pressure state in the step of forming the multi-layered wiring layer, in which the evacuating system of said processing chamber uses an evacuation pump constituted only with oil-free vacuum pump and the suction port side of said oil-free vacuum pump is connected to a supply source of a gas having molecular weight higher than that of helium (He), and wherein the pressure-reducing processing apparatus is a CVD apparatus for forming CVD films under a reduced pressure state through a vapor phase chemical reaction in which a considerable amount of hydrogen gas is produced.
A method of producing semiconductor devices including a step of forming a semiconductor element having a PN-junction on a semiconductor substrate and a step of forming a multi-layered wiring layer comprising an electrical wiring film for said semiconductor element and an insulation film for electrically insulating predetermined portions of said electrical wiring film, wherein the semiconductor substrate is contained in a processing chamber and wafer treatment is applied to the semiconductor substrate under a reduced pressure state in said processing chamber, the inside of said chamber being conditioned over a range from a normal pressure to a predetermined reduced pressure state in the step of forming the semiconductor element having the PN junction to the semiconductor substrate, in which the evacuating system of said processing chamber uses an evacuation pump constituted only with oil-free vacuum pump and the suction port side of said oil-free vacuum pump is connected to a supply source of a gas having molecular weight higher than that of helium (He), and wherein the pressure-reducing processing apparatus is a vacuum CVD apparatus for forming CVD films under a reduced pressure state through a vapor phase chemical reaction in which a considerable amount of hydrogen gas is produced.
A processing method for conducting processing for wafers under a reduced pressure state in a processing chamber evacuated by an oil-free vacuum pump wherein the oil-free vacuum pump comprises a centrifugal compression pump stage on the side of the suction port and a circumferential flow compression pump stage on the side of the discharge port, respectively, in which the rotational member of said centrifugal compression pump stage is constituted with open type vane having a plurality of sweep back blades, and the fixed member is constituted with a fixed disk having a plurality of blades attached at the radial outer portion thereof so as to be opposed to the rear face of said vane, said blades at the radial outer portion being inwardly directed relative to the rotating direction.
A method of producing semiconductor devices including a step of forming a semiconductor element having a PN-junction on a semiconductor substrate and a step of forming a multi-layered wiring layer comprising an electrical wiring film for said semiconductor element and an insulation film for electrically insulating predetermined portion of said electrical wiring film, wherein the semiconductor substrate is contained in a processing chamber and a polycrystalline silicon film is formed by a CVD process under a pressure-reduced state in said processing chamber, the inside of said chamber being conditioned over a range from a normal pressure state to a predetermined reduced pressure state, in which the evacuating system of said procesing chamber uses a pressure-reducing processing apparatus so adapted that an evacuation pump is constituted only with oil-free vacuum pump and the suction side of said oil-free vacuum pump is connected to a supply source of a gas having molecular weight higher than that of helium (He), and wherein the oil-free vacuum pump comprises a housing having a suction port and a discharge port, a rotational shaft rotatably supported within said housing, a plurality of fixed members attached to the inner wall of said housing and a plurality of rotational members attached to said rotational shaft, said fixed members and said rotational members are alternately combined with each other to constitute a pump stage, a centrifugal compression pump stage is constituted to said suction port side, while circumferential flow compression pump stage is constituted to said discharge port side respectively, and the rotation member of said centrifugal compression pump stage comprises an open type vane having a plurality of sweep back blades.
A method of producing semiconductor devices including a step of forming a semiconductor element having a PN-junction on a semiconductor substrate and a step of forming a multi-layered wiring layer comprising an electrical wiring film for said semiconductor element and an insulation film for electrically insulating predetermined portions of said electrical wiring film, wherein the semiconductor substrate is contained in a processing chamber and a polycrystalline silicon film is formed by a CVD process under a pressure-reduced state in said processing chamber, the inside of said chamber being conditioned over a range from a normal pressure state to a predetermined reduced pressure state, in which the evacuating system of said processing chamber uses a pressure-reducing processing apparatus so adapted that an evacuation pump is constituted only with oil-free vacuum pump and the suction side of said oil-free vacuum pump is connected to a supply source of a gas having molecular weight higher than that of helium (He), and wherein a plurality of oil-free vacuum pumps are disposed and at least one of said oil-free vacuum pumps comprises a housing having a suction port and a discharge port, a rotational shaft rotatably supported within said housing, a plurality of fixed members attached to the inner wall of said housing and a plurality of rotational members attached to said rotational shaft, said fixed members and said rotational members are alternately combined with each other to constitute a pump stage, a centrifugal compression pump stage is constituted to said suction port side, while circumferential flow compression pump stage is constituted to said discharge port side respectively, and the rotation member of said centrigual compression pump stage comprises an open type vane having a plurality of sweep back blades.
Dependencies are inferred from the claim text.