Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum

Apparatus for effecting thermal transfer with a workpiece in vacuum, comprising:

• a thermally-conductive platen including a heat transfer surface;
• a resilient, thermally-conductive polymer layer affixed to said heat transfer surface, said polymer layer having a thin quartz surface film for contacting said workpiece;
• and
• means for pressing said workpiece firmly into contact with said quartz surface film.

A method for effecting thermal transfer with a workpiece in vacuum, comprising the steps of:

• providing a thermally-conductive platen including a heat transfer surface;
• affixing a soft, thermally-conductive polymer layer to the heat transfer surface;
• forming on said polymer layer a thin surface film for contacting said workpiece without adhering thereto;
• and
• pressing the workpiece firmly into contact with the surface film.

Apparatus for effecting thermal transfer with a workpiece in vacuum, comprising:

• a thermally-conductive base having a heat transfer surface;
• a first thermally-conductive polymer layer affixed to said heat transfer surface;
• and
• a second thermally-conductive layer over said first layer, said second layer having a smooth surface for contacting said workpiece without adhering thereto.