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US 4,831,063 AGranted
Photocurable composition
AssigneeKabushiki Kaisha Toshiba
InventorsShuichi Suzuki, Moriyasu Wada, Shuzi Hayase
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Abstract
A photocurable composition comprising (1) an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule; (2) a metal compound present in an amount ranging from 0.001 to 10 wt. %, based on the epoxy compound; and (3) a silicon compound which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20 wt. %, based on the epoxy compound, is characterized by a particularly rapid curing rate.
Claims12
A photocurable composition comprising
- an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule;
- an organic aluminum compound formulated in an amount ranging from 0.001 to 10% by weight based on the epoxy compound;
- and
- a silicon compound having a peroxysilano group, which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20% by weight based on the epoxy compound.
1 more element
Dependencies are inferred from the claim text.