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US 4,823,234 AGranted
Semiconductor device and its manufacture
AssigneeDai-Ichi Seiko Co., Ltd.
InventorsAkira Konishi, Teruo Wakano
Life of this patent
Estimating the term…
Abstract
A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
Claims39
A carrier for semiconductor device, comprising;
- a plug-in type package having one or more semiconductor chips packaged therein;
- said plug-in type package comprising a flexible printed wiring substrate, electrically conductive terminals attached to said substrate, a heat sink for semiconductor attachment, and a surrounding package body,
- said substrate comprising an insulating film or this sheet with an opening and a plurality of through holes for terminal attachment, and printed wirings of conductor patterns formed on one or both sides of said insulating film or thin sheet;
- said terminals each having a collar portion, and each being inserted at its head portion into a respective through hole of the substrate so that said collar is in contact with said substrate, said terminals being electrically connected at said head or collar portions to the respective conductor patterns on the substrate;
- said heat sink being fixedly attached to said substrate so as to close the opening of said substrate, and
- said substrate, head and collar portions of said terminals and said heat sink being encapsulated in said package body so that one surface of said heat sink is exposed from one side of the package body.
3 more elements
A method for manufacturing carriers for semiconductor devices, comprising the steps of;
- preparing a printed wiring substrate having an opening and a plurality of through holes,
- fixing a plurality of terminals, each having a collar, to the substrate, said fixing of terminals being carried out by inserting a shank of each terminal into a respective through hole of the substrate so that the collar comes in contact with the substrate, and then deforming a projecting end of the shank into a head, in order to sandwich the substrate between the collar and the head of the terminals;
- loading the substrate fixed with the terminals into a cavity of an injection mold and placing a heat sink on the substrate to span the opening of the substrate,
- holding the heat sink and substrate in the mold;
- and
- injecting a resin into the cavity of the mold to form a package body which encapsulates the following;
- the head and collar portions of the terminals, part of the substrate, and part of the heat sink, leaving another part of the heat sink exposed for mounting the carrier thereon.
4 more elements
A plug-in type package for semiconductor devices, comprising;
- a flexible printed wiring substrate, electrically conductive terminals attached to said substrate, a heat sink for semiconductor attachment, and a surrounding package body,
- said substrate having a thin sheet with an opening and a plurality of through holes for terminal attachment, and having printed wirings of conductor patterns formed on one or both sides of said insulating film or thin sheet;
- said terminals each having a collar portion and being inserted at its head portion through a respective through hole of the substrate so that the collar is in contact with the substrate, the terminals being electrically connected at the head of collar portions to the respective conductor patterns on the substrate;
- said heat sink being fixedly attached to the substrate so as to close the opening of the substrate, and
- said substrate, head and collar portions of the terminals and the heat sink being encapsulated in said package body so that one surface of said heat sink is exposed from one side of the package body.
2 more elements
Dependencies are inferred from the claim text.