Method for forming cover layer over wire joint
AssigneeYazaki Corporation
InventorsAtsushi Sawaki, Mamoru Ono, Toshio Okazaki, Koji Naruse
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Abstract
The invention provides an improved method for forming a cover layer over a joint of electrical wires. Portions of insulation layers of wires to be joined are stripped and the bared conductors of the wires assembled in a desired configuration to form a joint. The joint is placed in a transparent mold and the mold is filled with a photosetting resin. Radiation of an appropriate wavelength is then passed through the mold to harden the resin.
Claims6
A method for forming a cover layer over a joint of electrical wires, comprising the steps of:
- assembling a plurality of electrical wires to form a joint;
- placing said joint in a transparent mold;
- filling said mold with a photosetting resin;
- applying radiation through said mold to harden said resin;
- and
- removing said mold after said resin is hardened.
A method for forming a cover layer over a joint of electrical wires, comprising the steps of:
- assembling a plurality of electrical wires to form a joint;
- wrapping said joint with an insulating electrical tape;
- placing said joint in a transparent mold;
- filling said mold with a photosetting resin;
- and
- applying radiation through said mold to harden said resin.
Dependencies are inferred from the claim text.