Screen printing method for producing lines of uniform width and height
AssigneeInternational Business Machines Corporation
InventorsMichael E. Cropp, Phillip De Prado, Kamalesh S. Desai
Life of this patent
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Abstract
An improved method for screen printing fine lines of conductive paste on a substrate wherein a mask having a desired pattern of line shaped openings is placed on the substrate, and conductive paste screened in the openings in the mask in contact with the substrate, and also as a thin layer over the top surface of the mask. The mask is removed from the substrate before the conductive paste in the openings dries, thereby leaving a fine pattern of paste lines with a uniform height on the substrate.
Claims15
An improved method of screen printing fine lines of electrically conductive paste on a substrate, comprising,
- obtaining a substrate capable of absorbing solvent from a conductive paste to be applied,
- placing a mask having the desired pattern of line shaped openings on the substrate,
- applying conductive paste to the mask such that conductive paste is screened in the openings in the mask in contact with the substrate and such that a thin layer of conductive paste is formed over the top surface of the mask, the thin layer capable of maintaining the paste in the openings fluid by supplying solvent, thereby allowing the paste to flow through the openings when the mask is lifted, and
- removing the mask from the substrate before the conductive paste dries thereby leaving a line pattern of paste with a well-defined, symmetrical, smooth profile, with a relatively low height on said substrate.
Dependencies are inferred from the claim text.