Metallized substrates and process for producing
AssigneeEngelhard Corporation
InventorPascaline H. Nguyen
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Abstract
The present invention is directed to metallized substrates and particularly metallized substrates for use in microwave integrated circuits and a process for producing such substrates. The metallized substrates generally comprise a dielectric substrate on which is formed a pattern such as a conductor line pattern, the pattern being formed of a conductive metal. The metallization is accomplished by forming one or more adhesion layers from a metallo organic composition which is built up with a metal conductor.
Claims19
A metallized substrate comprising a dielectric substrate, a metal layer produced from a metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium, and a conductive metal layer thereon.
A process for producing a metallized substrate comprising forming a first adhesion promoting layer by applying a metallo organic composition to a dielectric substrate and thereafter forming a conductive layer thereon said metallo organic composition comprising at least one precious metal resinate in an amount of from about 4 to 25 percent, at least one film forming in an amount of from about 0.01 to 1.0 percent, at least one base metal resinate in an amount of from about 0.1 to 3 percent and a suitable medium.
Dependencies are inferred from the claim text.