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US 4,803,689 AGranted
Semiconductor laser module
AssigneeNEC Corporation
InventorNaoki Shibanuma
Life of this patent
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AssigneeNEC Corporation
InventorNaoki Shibanuma
Estimating the term…
A dual-inline-package semiconductor laser package incorporating a temperature controlling Peltier element and housed in a box shape metal case having a window glass includes: the metal case having a window glass which is hermetically sealed in a side wall portion thereof; a substrate fixed on the Peltier element which is fixed in the metal case; a semiconductor laser fixed on the substrate through a chip carrier; a first lens, a light-detecting element, and a thermister fixed on the substrate; a second lens supported by a holder; an optical fiber, a portion near the distal end of which is protected by a metal sleeve; and a slide ring having an inner diameter slightly larger than an outer diameter of the metal sleeve. A side wall around the window glass of the case is bonded to the holder, the holder is bonded to the slide ring, and the slide ring is bonded to the metal sleeve.
A semiconductor laser module, in which a semiconductor laser and a Peltier element for controlling a temperature of said semiconductor laser are mounted in a box shaped metal case, and which has a light-outputting fiber, a portion near distal end of which is protected by a metal cylinder, comprising:
A semiconductor laser module, in which a semiconductor laser and a Peltier element for controlling a temperature of said semiconductor laser are mounted in a box shaped case, and which has a light-outputting fiber, a portion near distal end of which is protected by a cylinder, comprising:
A semiconductor laser module, in which a semiconductor laser is mounted in a box shaped case, and which has a light-outputting fiber, a portion near distal end of which is protected by a cylinder, comprising:
Dependencies are inferred from the claim text.