Vacuum pick and place mechanism for integrated circuit test handler

A mechanism for transporting at a high speed a succession of integrated circuits (IC's) which are movable in a guide track section along a product flow path from a staging area to a test site that is displaced horizontally from a test plane along a first direction transverse to said flow path, comprising:

• lateral guide means extending from said staging area to said test site,
• a slide member movable in a reciprocating manner along said lateral guide means between a pick position at said staging area and a place position at said test site,
• a pick mounted on said slide member adapted to vacuum grip an IC at said staging area and carry it to said test site in coordination with a corresponding movement of said slide member,
• means for driving said slide member and pick between said pick and place positions,
• means for driving said IC along said first direction between said place position and a test position,
• a first stop spring biased to extend into the product flow path to hold said IC at said pick position,
• a second stop spring biased to extend into the product flow path to locate said IC at said test site after it is transported by said vacuum pick, and
• cam surfaces on said slide member that disengage said holding means when said frame is in its pick position to allow the transport of said IC and engage said locating means when said frame is in its place position.