Multilayer printed circuit board with domain partitioning

A multilayer printed circuit board comprising:

• a first layer of copper having a surface which is partitioned into a plurality of domains;
• each domain has the same surface dimensions as the other domains;
• a first layer of dielectric located beneath said first layer of copper;
• each domain is masked and etched to have a pattern of conductors for connecting up to a predetermined number of components for each domain;
• a second layer of copper bonded to a side of said first layer of dielectric opposite to said first layer of copper, masked and etched to have a pattern of conductors and connection pads for a supply of voltage from a first power supply;
• a second layer of dielectric material bonded beneath said second layer of copper;
• a third layer of copper bonded beneath said second layer of dielectric, masked and etched to have a pattern of conductors and connection pads running in a first direction for transmission of a first number of electrical signals;
• a third layer of dielectric bonded beneath a third layer of copper;
• a fourth layer of copper bonded beneath said third layer of dielectric, masked and etched to have a pattern of conductors and connection pads for connection to a first circuit ground;
• a fourth layer of dielectric bonded beneath said fourth layer of copper;
• a fifth layer of copper bonded beneath said fourth dielectric layer, masked and etched to have a pattern of conductors and connection pads running in a second direction perpendicular to said first direction for transmission of a second number of electrical signals;
• a fifth layer of dielectric bonded beneath said fifth layer of copper;
• a sixth layer of copper bonded beneath said fifth layer of dielectric, masked and etched to have a pattern of conductors and connection pads for a supply of voltage of a second power supply;
• a sixth layer of dielectric bonded beneath said sixth layer of copper;
• a seventh layer of copper bonded beneath said sixth layer of dielectric, masked and etched to have a pattern of conductors and connection pads running in said first direction for transmitting a third number of electrical signals;
• a seventh layer of dielectric bonded beneath said seventh layer of copper;
• an eighth layer of copper bonded beneath said seventh layer of dielectric, masked and etched to have a rectangular pattern of holes in said eighth layer of copper, each for locating a respective plated-through hole conductor;
• said eighth layer of copper for conducting signals and supplying current to ground;
• and
• at least one spoke element connecting a plated through hole to ground at said eighth layer of copper.