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US 4,796,078 AGranted
Peripheral/area wire bonding technique
AssigneeInternational Business Machines Corporation
InventorsDouglas W. Phelps, Jr., Robert J. Redmond, William C. Ward
Life of this patent
Estimating the term…
Abstract
An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
Claims18
A electronic assembly comprising:
- a first lead frame having a number of projecting leads;
- an electronic device mounted on said first lead frame, said electronic device having a series of peripheral and center contact pads, means to establish electric contact between said first lead frame and said peripheral contact pads;
- an adhesive insulative tape on both said first lead frame and said electronic device;
- a second lead frame having a number of projecting leads and mounted on said tape, and means to establish electric contact between said center contact pads and the leads of said second lead frame.
1 more element
An electronic assembly comprising:
- first and second lead frames stacked and separated from each other by an insulative adhesive material;
- an electronic device mounted on said first lead frame, said electronic device having center and peripheral contact pads, said electronic device further having insulative adhesive tape material applied thereto to separate said second lead frame from said electronic device;
- and
- means to establish electric contact between said electronic device and said first and second lead frames.
1 more element
Dependencies are inferred from the claim text.