Bonding method and adhesive useful for the method
AssigneeCemedine Co., Ltd.
InventorsNaomi Okamura, Hiroshi Aoki, Junzo Makino, Hajime Yagi, Yasuo Arai, Takashi Yamanaka
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AssigneeCemedine Co., Ltd.
InventorsNaomi Okamura, Hiroshi Aoki, Junzo Makino, Hajime Yagi, Yasuo Arai, Takashi Yamanaka
Estimating the term…
A method for bonding two objects by means of the following two adhesives: (A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound, and a 1,1-disubstituted diene compound; and (B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
A method for bonding two objects by means of the following two adhesives:
Dependencies are inferred from the claim text.