Data carrier having an integrated circuit and method for producing same

A multilayer data carrier, such as a laminated card, comprising:

• a core layer including at least one recess;
• upper and lower cover layers on opposite sides of the core layer, at least said upper layer including at least one aperture;
• an IC module for processing electrical signals;
• a flexible, filmlike substrate having at least one recess;
• at least one contact pad having an integral contact surface area and a lead for connecting the IC module with an external device;
• said contact pad contact surface area and said lead comprising a thin, electrically conductive coating, said contact pad disposed on the substrate and said lead disposed at least in part on the substrate;
• said IC module disposed in the at least one recess of the substrate;
• said substrate embedded between the core and cover layers in such a way that the IC module is located in the recess in the core layer and the contact surface is located in said at least one aperture in the upper cover layer;
• said flexible substrate being deformed with portions of the substrate carrying the contact pad disposed so that the contact surface is flush with the surface of the upper cover layer and other portions of the substrate carrying the lead which establishes the contact to the IC module being deformed as by bending into a median plane of the data carrier.