Superlattice semiconductor having high carrier density
AssigneeNEC Corporation
InventorsToshio Baba, Takashi Mizutani, Masaki Ogawa
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Abstract
The superlattice type semiconductor material has a multilayered structure of first layers of semiconductor containing impurities and having a thickness thinner than electron or hole wavelength and second layers of semiconductor free from impurities or insulator having such a thickness that electrons or holes may penetrate by tunneling effect, the first and second layers being alternately piled. Electrons or holes distribute uniformly over the entire of the multilayered structure to show a property of uniform semiconductor material.
Claims6
A superlattice type semiconductor having a multilayered structure of alternately piled first and second layers, said first layers being made of a semiconductor which does not involve aluminum, a combination of arsenic and phosphorus, a combination of arsenic and antimony and a combination of silicon and germanium as elements, each of said first layers having a thickness with a range from 5 .ANG. to 100 .ANG. and having an N-type impurity doped region sandwiched by impurity-free regions, said impurity-free regions contacting said second layers, said second layers being impurity-free and made of a material having an electron affinity smaller than said semiconductor and each of said second layers having a thickness within a range from 5 .ANG. to 100 .ANG..
Dependencies are inferred from the claim text.